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УДК 621. 10.515


Salenko1 O., Gabuzyan1 G., Myronov1 Y., Nikitin2 V.
1-Kremenchuk Mykhailo Ostrohradskyi National University, Kremenchuk;

2-Enterprise «Print Inzhiniring, OOO», Kiev, Ukraine


ABOUT SOME RESULTS OF PROCESSING SiC-MICROARRAYS BY HYDROABRASIVE PRECISION JET


Саленко1 A.Ф., Габузян1 Г.В., Миронов1 Я.В., Никитин2 В.А.
1-Кременчугский национальний университет им. М. Остроградского, г. Кременчуг, Украина;
2- ООО «ПринтИнжиниринг», г. Киев, Украина


О НЕКОТОРЫХ РЕЗУЛЬТАТАХ ОБРАБОТКИ SiC-МИКРОЧИПОВ ПРЕЦИЗИОННОЙ ГИДРОАБРАЗИВНОЙ СТРУЕЙ

 

Abstract. Purpose. Performing cutting of the microarrays to the individual elements using ultrahigh pressure jet with a finely dispersed abrasive.
Design/methodology/approach. The theory of the hydro abrasive jetting difficult to machine materials. A functional approach to ensure the quality and accuracy of processing.
Findings. In a paper was proved the possibility of using small diameter jet stream to perform precise cuts of microchips with hard and brittle materials, such as SiO-chips with double-sided metalized. Using a functional approach allowed to reduce width of the damage of metallization
Originality/value. The original way of SiO-microarrays cutting using the slotted masks is purposed. The use of such masks significantly increases quality and accuracy of the edges of dissected chip.
Keywords: SiC-microarrays, hydro abrasive jetting, cutting quality

 

REFERENCES
1. Salenko A., O. Fomovska, V. Dudyuk, O. Mana. About some results of exploration of water jet guided laser onto the solids’surface. Unitex, 10: International scientific conference 19-20 November 2010, Gabrovo2010. P. 414-421.
2. TECH front Cutting Laser Guided by Waterjet. Damage-free wafer dicing using the water jet guided laser technology. DelphinePerrottet, Dr. Tuan Anh Mai and Dr. BernoldRicherzhagen, Synova SA, Ch. De la Dent-d’Oche, CH-1024 Ecublens, Switzerland. J. 2005
3. Gentle dicing of thin semiconductor materials by water-jet-guided laser. Yasushi Kozuki, DelphinePerrottet, Phil Durrant and BernoldRicherzhagen. Synova Japan, 2-949-12 Nanyo, Nagaoka-shi, Niigata-ken 940-1164 Japan. Synova SA, Ch. de la Dent-d’Oche, CH-1024 Ecublens, Switzerland. Proceedings of the 4th International Congress on Laser Advanced Materials Processing.
4. On the experience of the application of the functional approach to getting by waterjets deaf cuts in sintered superhard materials. A. Salenko, S. S. Strurinskyi. Cutting and tool for professionals, No 4. Kharkov, 2011. p. 56-62.
5. Tikhomyrov R., V. Guenko Waterjet cutting non-metallic materials. К. Vyshcha shkola, 1996. 180 p.
6. Salenko O.F., O.V. Fomovska, V.G. Dotsenko Improving the quality of cutting sheet materials by hydro abrasive jet of small diameter. Scientific Papers "High technologies in engineering", no 2, 2008. Kharkiv, NTU «KhPI». p. 115-124.

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